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CERTIFICATION COURSE

High-Speed
PCB Design

Bridge the gap in competencies required to design state-of-the-art electronics. Master Signal Integrity, DDRx, PCIe, and HDI technologies.

#DDR4 #PCIe #HDMI #SATA #USB #ETHERNET #LVDS #HDI #Controlled_Impedance
Signal Integrity
Multilayer Stackup

Course Structure

Module 1: Board Design Basics
  • PCB Evolution & Manufacturing Challenges
  • Fabrication methodologies (SSB, DSB, Multilayer)
  • Design rules for Analog, Digital & Power
  • EMI/EMC Analysis (Conducted & Radiated emission)
  • Thermal Management & Cross-talk basics
Module 2: Multilayer Design
  • Multilayer PCB design guidelines
  • Stack-up Design & Layer Ordering
  • Differential Pair Routing
  • Length Matching techniques
  • Report Generation & Validation
Module 3: High Speed Signaling
  • Signal Integrity & Power Integrity (SI/PI)
  • Impedance Matching, Termination & Topology
  • DDR3/4 Preliminary Layout & Fanout
  • Back-Drilling Vias & HDI concepts
  • Timing Vision & Length Tuning
Module 4: Semiconductor Packages
  • Single Chip Modules (SCM)
  • Multichip Modules (MCM) & Trends
  • System-in-Package (SiP)
  • Hybrid Circuits & Packaging Roadmaps

What You Will Master

Advanced Placement

Placing CPU, RAM, PCIe, HDMI, DCaps, and Pull-ups for optimal performance.

Memory Routing

DDR2/3/4 Layout, T-branch vs Fly-by topology, Pin & Bank swapping.

Length Tuning

Matching for PCIe, HDMI, LVDS, GbE, USB, SATA, and CAN BUS.

Finishing & Gerber

Mechanical drawings, Manufacturing notes, and Gerber file verification.

Course Outcomes

Analyze customer requirements & interpret user needs
Verify design feasibility against specifications
Create efficient chip designs (Optimal power & Area)

Eligibility:

B.E./B.Tech/MSc/Diploma in Electronics, Communication, Electrical, Instrumentation, CS, or IT.

Enquire & Join Now